TAB Bonding Machine

TAB Bonding Machine

 Application:

The machine is used for bonding FPC, COF, TAB onto various LCD panels and PCB.

 

Basic Parameter

Voltage:AC220V 50-60HZ

Operation Mode:7" interface

Rating Power:1.5kw(constant heat) 4kw (pulseheat)

LCD Table:Servo memory and auto location

Pressure:0.4-0.8Mpa

TAB Fixture:Micrometer adjust X-Y-θ

Bond Head :60mm(constant heat)  50mm(pulse heat)

Thermocouple:K type

Rolliing Mode:Auto 

Program Control:PLC and servo controller

Vision system:Two C/C CCD

Heat Mode:Constant heat and pulse heat

Weight:320kg

Dimension: (L)2210x  (W)1730 x  (H)1455mm

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Contact Us

Company Name: SUNSOM Automation Equipment Co.,ltd.
Contact Person: Michael
Address:  
Zip: 518103
Telephone: 86-13808809441
Fax:  
E-mail: szcanasales@hotmail.com
Website: http://sunsom.tradeee.com

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