FOG/FOB Bonding Machine

FOG/FOB Bonding Machine

Application:

The machine is used for bonding FPC, COF, TAB onto various LCD panels and PCB.

 

Basic Parameter

Voltage:AC220V 50-60HZ

Rating Power:1.5KW (constant heat) 4kw (pulse heat)

Operation Mode:7" interface

LCD Table:Servo memory and auto-location system

Input Gas:0.4-0.8Mpa

Fixture:Micrometer adjust X-Y-θaxis

Bond Head :60 mm(constant heat) 50mm(pulse heat)

Thermocouple:K type

Rolling Mode:Auto

Program Control: PLC and servo controller

Vision System:Two C/L CCD 

Heat Mode: Constant heat and pulse heat

Weight: 300kg

Dimension:(L)1200 x (W)895  x (H)1440mm

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Contact Us

Company Name: SUNSOM Automation Equipment Co.,ltd.
Contact Person: Michael
Address:  
Zip: 518103
Telephone: 86-13808809441
Fax:  
E-mail: szcanasales@hotmail.com
Website: http://sunsom.tradeee.com

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