COG Alignment(Pre-bond) Machine

COG Alignment(Pre-bond) Machine

Application:

The machine is used for aligning and pre-bonding IC driver onto various LCD glasses.

 

Basic Parameter

Voltage: AC220V 50-60HZ

Rating Power:0.75KW

Pressure:0.4-0.8Mpa

Stored Parameter: 50 sets

Operation Mode: 7" interface

Work Mode: Double stations fixed work

Alignment System: Cross mark position

Aligning Accuracy: ±3um

Bond Head: L1-45mm W1-5mm (Customization)

Ambient Treatment: FFU high efficient filtration

Fixture: Micrometer adjust X-Y-θaxis

IC Tray: 2" 3"  4"

Weight:250kg

Dimension:(L)1000 x (W)770x (H)1650mm

Product Origin:  
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Contact Us

Company Name: SUNSOM Automation Equipment Co.,ltd.
Contact Person: Michael
Address:  
Zip: 518103
Telephone: 86-13808809441
Fax:  
E-mail: szcanasales@hotmail.com
Website: http://sunsom.tradeee.com

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