Double Head COG Main-bonding M/C

Double Head COG Main-bonding M/C

Application:

The machine is used for bonding IC driver onto various LCD glasses.

Basic Parameter

Voltage:AC220V 50-60HZ

Rating Power:1.5KW

Pressure:0.4-0.8Mpa

Work Mode:Double stations fixed work

Operation Mode:7" interface

Program Control:PLC controller

Bond Head:60x5mm(customization)

Stored Parameter:50 sets

Rolling Mode:Auto

Pressure:0.01-0.8MPA 

Thermocouple:K type

Heat Mode:Constant heat

Weight:260kg

Dimension:L950 x W535 xH1285mm

 

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Contact Us

Company Name: SUNSOM Automation Equipment Co.,ltd.
Contact Person: Michael
Address:  
Zip: 518103
Telephone: 86-13808809441
Fax:  
E-mail: szcanasales@hotmail.com
Website: http://sunsom.tradeee.com

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